The first Process Industry Data Model Integration Congress (PIDMIC 1.0) was held in the context of ACHEMA 2022 and marked the starting point of a recurring congress format dedicated to […]
PIDMIC 1.0 @ ACHEMA 2022 Read More »
This year, the DEXPI working group is proud to be very active at ACHEMA 2022 in Frankfurt, August 22nd-26th. DEXPI will have its own booth in the “Digital Innovation Zone”
DEXPI @ ACHEMA 2022 Read More »
“The first version of the DEXPI OPC UA companion specification, a joint effort of the DEXPI group and the OPC Foundation, has been officially published on the 10th of September
First version of the DEXPI OPC UA companion specification Read More »
Our new DEXPI P&ID Specification 1.3 is live! After release of DEXPI 1.2 we updated, refined and extended the DEXPI information model: Some highlights: Equipment types added for solid processes
DEXPI P&ID Specification 1.3 released Read More »
SmartPlant PID by Intergraph PP&M Deutschland GmbH has been awarded a DEXPI Export Certificate for Test Round 3 (2021). Certificate ID 2 DEXPI Version DEXPI P&ID Specification Version 1.2 Software
2021 Test Round 3 – DEXPI Export Certificate awarded to Hexagon Read More »
AutoCAD Plant 3D by Autodesk, Inc. has been awarded a DEXPI Export Certificate for Test Round 3 (2021). Certificate ID 1 DEXPI Version DEXPI P&ID Specification Version 1.2 Software Version
2021 Test Round 3 – DEXPI Export Certificate awarded to Autodesk Read More »
The DEXPI Initiative is very pleased to announce that the final release candidate of the DEXPI P&ID Specification 1.3 is now open for public comments. DEXPI Specification 1.3 Final Release
DEXPI Specification 1.3 Release Candidate Open For Public Comments Read More »
On October 11th, 2020, Heiner Temmen (Evonik) and Reiner Meyer-Rössl (Autodesk) presented an overview of the data initiatives and standard bodies relevant to the process industry and the current collaboration
DEXPI presentation at #PAAT JT 2020 Read More »
The DEXPI initiative presented itself at a seminar organized by Swedish SEIIA and Finnish THTH on May 14, 2020. The webinar was a continuation of the presentations of the Norwegian
DEXPI introduction at SEIIA THTH May webinar Read More »
At the Autodesk University 2019 in Las Vegas/U.S. Gerardo Santillán from Semantum and Reiner Meyer-Rössl from Autodesk gave a lecture about creating a Digital Twin based Industry Standards like DEXPI
DEXPI presentation at AU 2019 in Las Vegas Read More »
